Emerging food packaging technologies : principles and practice

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Bibliographic Details
Other Authors: Lee, Dong-Sun., Yam, Kit L.
Format: E-Book
Language: Anglais
Published: Oxford, Cambridge, Philadelphia [etc.] : Woodhead Pub., 2014.
Subjects:
Autres localisations: Voir dans le Sudoc
Online Access: Accès à l'E-book
Related Items: Additional form: Emerging food packaging technologies