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01387nam a22002897a 4500 |
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ebook-170234215 |
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130625s2001 xxg ||| |||| 00| 0 eng d |
| 020 |
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|a 9780080492247
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| 041 |
0 |
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|a eng
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| 100 |
1 |
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|a Lee, Ning-Cheng.
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| 245 |
1 |
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|a Reflow Soldering Processes and Troubleshooting :
|b SMT, BGA, CSP and Flip Chip Technologies
|c Ning-Cheng Lee.
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| 256 |
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|a Données textuelles
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| 260 |
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|a Burlington, MA, USA :
|b Elsevier Science & Technology Books,
|c 2001.
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| 500 |
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|a Titre provenant de la page de titre du document numérique
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| 500 |
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|a Numérisation de l'édition de Burlington, MA, USA : Elsevier Science & Technology Books, 2001
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| 500 |
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|a La pagination de l'édition imprimée correspondante est de 280 p.
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| 500 |
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|a Type of computer file: Fichier html
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| 538 |
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|a Configuration requise : navigateur internet
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| 650 |
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|a Electric connectors
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| 650 |
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|a Electronic apparatus and appliances
|x Design and construction
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| 650 |
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|a Electronic packaging
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| 650 |
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|a Solder and soldering
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| 776 |
0 |
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|t Reflow Soldering Processes and Troubleshooting
|b Texte imprimé
|f Ning-Cheng Lee
|c Burlington, MA, USA
|n Elsevier Science & Technology Books
|d 2001
|p 1 vol. (280 p.)
|z 978-0-7506-7218-4
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| 856 |
4 |
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|u https://srvext.uco.fr/login?url=https://univ.scholarvox.com/book/40000621
|z Accès à l'E-book
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| 993 |
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|a E-Book
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| 994 |
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|a BNUM
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| 995 |
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|a 170234215
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